WAFERS FOR DISCRETE DEVICES
AS SLICED AND AS LAPPED WAFERS
Non polished silicon wafers are used for a variety of discrete and solar cell applications.
The typical process flow for polished silicon wafers is Slicing — Lapping or Grinding — Etching — Polishing.
SEH can supply wafers as sliced (as cut), as lapped, and as etched. The choice will depend on the degree of surface topography and surface damage which may be tolerated by your process.
200mm wafers may be available in As-Sliced, Lapped, or Etched versions. Please inquire.
Example of DW equivalents to Thick EPI wafers
200mm wafers may be available in As-Sliced, Lapped, or Etched
versions. Please inquire.